Our Technology
IC PACKAGING / SUB ASSEMBLY
Some of Stars’ key technologies are embedded in our hi-precision machines and testing equipment, where accuracy can reach a few microns. As technology is advancing more rapidly and consumers are demanding more customization, Stars puts efforts on new technologies that will further advance the value of packaging and lead to total solutions for its customers.

Processes include :
• Die Attach
• Wire Bonding
• Molding
• Trim & From
• Laser Marking
• Test & Packing
• MEMS

IC Packaging :
Leadless free Package Portforlio
Lead Package Portforlio
Other Our Technology
BOX BUILD / PCBA
To meet customer demands, Stars has developed a tremendous breadth of expertise, complex technologies and processes for multiple industries. Our hi-speed production lines and lean manufacturing can help customers move products to market faster while lowering costs. From the Bill of Material (BOM) and drawings, we can offer complete solutions including mechanical assembly, PCBA, software installation supplied in their own packaging material.
BOX BUILD / PCBA
WAFER PROCESSING
Stars has vast experience of Wafer handling technologies, which consist of back grinding, polishing, dicing and inspection. After inspection, we put the individual die in a gel-pack, to safely transport and handle valuable devices to customer or IC packaging’s production lines.
WAFER PROCESSING