
Our Technology
WAFER PROCESSING
Stars has vast experience of Wafer handling technologies, which consist of back grinding, polishing, dicing and inspection. After inspection, we put the individual die in a gel-pack, to safely transport and handle valuable devices to customer or IC packaging’s production lines.
Processes include :
• Back Grinding
• Polishing
• Dicing (Mechanical Dicing, Laser Dicing)
• Inspection & Test
Processes include :
• Back Grinding
• Polishing
• Dicing (Mechanical Dicing, Laser Dicing)
• Inspection & Test